Microwave integrated circuits fabrication on alumina substrate using pattern up direct electroless nickel and immersion Au plating and study of its properties

► Proposed method is much simpler than the either of the conventional or PUP based MICs fabrication techniques. ► Proposed method is a suitable alternative to the conventional lithography and PUP technique. ► Conducting layer on MICs fabricated, shows excellent adhesion, solderability and bondabilty. ► Copper film is covered from all the three sides so no copper is prone to environment. ► Input return loss, output return loss, insertion loss and isolation are within acceptable range.