Effect of the combination of surface finishes and solder balls on JEDEC drop reliability of chip-scale packages

► This study looks at ENEPIG, as it is paired with three solder compositions. ► Board-level chip-scale packages subjected to a JEDEC drop test. ► Sb, Ni and Pt were minor doped for enhancing strength and good wettability. ► The drop performances of ENEPIG are found better than those of Ni/Au. ► Most of the failure modes are on the test board side along the brittle interfaces.