Fabrication of air gap dielectrics by nanoimprint lithography

► We report a powerful new route to fabricate air gap dielectrics with well-defined pore geometries. ► Method utilizes the combination of nanoimprint lithography and a sacrificial template approach. ► Successful fabrication of defect free mechanically robust air gap films (ultra-low k value of 1.9). ► Attractive candidates as interlayer dielectrics for next-generation integrated circuit applications.