کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7045599 | 1457093 | 2018 | 20 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A single phase hybrid micro heat sink using impinging micro-jet arrays and microchannels
ترجمه فارسی عنوان
یک فروسرخ گرمای خنک کننده هیبرید تک فاز با استفاده از آرایه های میکرو جت و میکرو کانال ها
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
جریان سیال و فرایندهای انتقال
چکیده انگلیسی
This work describes the development of a single phase water-cooled microfluidic heat exchanger for cooling very high heat flux electronics. The heat sink was designed so that it can be manufactured using the MICA Freeform process, which is an ultra-precision additive manufacturing method for millimeter-scale metallic parts with micron-scale features. The heat sink targets a heat flux of 1000â¯W/cm2 with an average base temperature constraint of 65â¯Â°C for a 4â¯mmâ¯Ãâ¯3â¯mm heat source. The hydraulic constraints that were imposed on the design were that the pressure drop and flow rates could not exceed 100â¯kPa and 0.5â¯L/min respectively. The design was undertaken using Simulation-Driven Design whereby the commercial Computational Fluid Dynamics software ANSYS Fluent was utilized. The final embodiment of the design is a hybrid Microjet-Microchannel heat sink. The thermal performance is quite extraordinary, with a predicted effective thermal conductance of 400â¯kW/m2â¯K for a flow rate of 0.5â¯L/min. With such an exceptionally high thermal conductance, the heat sink is predicted to maintain an average base temperature of under 58â¯Â°C with a maximum variation about the mean of ±3â¯Â°C for an imposed heat flux of 1000â¯W/cm2.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Thermal Engineering - Volume 136, 25 May 2018, Pages 408-418
Journal: Applied Thermal Engineering - Volume 136, 25 May 2018, Pages 408-418
نویسندگان
A.J. Robinson, R. Kempers, J. Colenbrander, N. Bushnell, R. Chen,