Quasi-planar bulk CMOS technology for improved SRAM scalability

A simple approach for manufacturing quasi-planar bulk MOSFET structures is demonstrated and shown to be effective not only for improving device performance but also for reducing variation in 6T-SRAM read and write margins, in an early 28 nm CMOS technology. With optimization of the pocket implant doses, voltage scaling is facilitated. Since its benefits increase with decreasing channel width, quasi-planar bulk MOSFET technology should be advantageous for future CMOS technology generations (22 nm and beyond).