New method for boron removal from silicon by electron beam injection

A new method for boron removal from silicon using electron beam injection (EBI) is proposed. After thermal oxidation on monocrystalline silicon (100) wafer at 1000 °C for 1 h, EBI was used to induce thermal and negative charging effects to enhance boron diffusion in the oxide film and the silicon substrate. This facilitates boron removal from the silicon substrate. The boron concentration in samples was measured by secondary ion mass spectrometry. The results show that EBI reduced the boron concentration in the silicon substrate by 4.83%.