Simulation of dynamic fracture along solder–pad interfaces using a cohesive zone model

In this paper, dynamic fracture of a single solder joint specimen is numerically simulated using the finite element method. The solder–IMC and IMC–Cu pad interfaces are modeled as cohesive zones. The simulated results show that under pure tensile loading, damage typically starts at the edge of the solder–IMC interface, then moves to IMC–Cu pad interface. Eventual failure is typically a brittle interfacial failure of the IMC–Cu interface.