Correlating internal stresses, electrical activity and defect structure on the micrometer scale in EFG silicon ribbons

In the present paper, we study the influence of defects through their stress fields on the electrical activity and residual stress states of as-grown edge-defined film-feed (EFG) multicrystalline silicon (mc-Si) ribbons. We apply a combination of micro-Raman spectroscopy, electron beam induced current, defect etching and electron backscatter diffraction techniques that enables us to correlate internal stresses, recombination activity and microstructure on the micrometer scale. The stress fields of defect structures are considered to be too small (several tens of MPa) to influence directly the electrical activity, but they can enhance it via stress-induced accumulation of metallic impurities. It is commonly found that not all recombination-active dislocations on grain boundaries (GBs) and within grains are accompanied by internal stresses. The reason for this is that dislocations interact with each other and tend to locally rearrange in configurations of minimum strain energy in which their stress fields can cancel partially, totally or not at all. The outcome is a nonuniform distribution of electrical activity and internal stresses along the same GB, along different GBs of similar character as well as inside the same grain and inside different grains of similar crystallographic orientations. Our work has implications for developing crystal growth procedures that may lead to reduced internal stresses and consequently to improved electrical quality and mechanical stability of mc-Si materials by means of controlled interaction between structural defects.

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► Defect-related stresses of several tens of MPa do not influence directly the electrical activity.
► Stress fields of defects increase recombination by promoting the accumulation of impurities.
► Defects interact with each other and tend to arrange in configurations of minimum strain energy.
► Nonuniform distribution of electrical activity and internal stresses on the micrometer scale.