کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7991274 | 1516138 | 2018 | 30 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Diffusion bonding of Ti2AlNb alloy using pure Ti foil as an interlayer
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
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چکیده انگلیسی
In this work, the vacuum diffusion bonding process was employed to robustly join Ti2AlNb alloy using pure Ti foil as an interlayer. The effects of bonding parameters on the interfacial microstructure evolution and mechanical properties of the Ti2AlNb bonded joints at both room temperature and elevated temperatures were investigated in detail. The results showed that the joint consisted mainly of two characteristic zones: diffusion zone I and central zone II, and both these zones were composed of α-Ti and β-Ti phases. The thickness of diffusion zone I as well as the formation of lamellar α and β phases in the central zone II was dependent primarily on the diffusion of the Nb and Al elements from the Ti2AlNb alloy into the Ti interlayer, which was controlled by the modification of bonding parameters. The joint diffusion bonded at 960â¯Â°C for 60â¯min under a pressure of 20â¯MPa showed a maximum room temperature shear strength of 664â¯MPa, and its shear strengths at 500â¯Â°C, 650â¯Â°C, and 800â¯Â°C were 442â¯MPa, 384â¯MPa, and 305â¯MPa, respectively. With increases of diffusion bonding temperature and holding time, the shear strength of the Ti2AlNb bonded joints improved owing to the enhanced elemental interdiffusion across the interface. Meanwhile, the fracture path changed from the interface between diffusion zone I and center zone II to center zone II. The fracture morphologies of the joints after the shear tests were characterised mainly by a dimple-like structure, which corresponded to a ductile rupture.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 756, 5 August 2018, Pages 163-174
Journal: Journal of Alloys and Compounds - Volume 756, 5 August 2018, Pages 163-174
نویسندگان
Y. Wang, X.Q. Cai, Z.W. Yang, D.P. Wang, X.G. Liu, Y.C. Liu,