کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7993478 | 1516151 | 2018 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
An investigation on diffusion bonding of TZM alloy and Nb-Zr alloy using Ni foil as an interlayer
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
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چکیده انگلیسی
Diffusion bonding of TZM alloy and Nb-Zr alloy without and with Ni interlayer was carried out at the temperature ranging from 1000â¯Â°C to 1100â¯Â°C for 30min under a pressure of 10â¯MPa. The effects of bonding temperature and the thickness of Ni interlayer on the microstructure and mechanical properties of the diffusion bonded joints were investigated systematically. Compared with the direct diffusion bonding method, sound TZM/Nb-Zr joints were obtained with Ni interlayer at a low bonding temperature of 1000â¯Â°C. When the bonding temperature was 1100â¯Â°C, sound joints could be achieved for both methods. But the joint shear strength with 30â¯Î¼m Ni interlayer reached 228â¯MPa, which was 60% higher than that bonded without Ni interlayer. The diffusion-induced reaction layers were determined to be NiMo, Ni3Mo + Ni4Mo, Ni8Nb, Ni3Nb and Ni6Nb7, whose thickness and micro-hardness were measured at different bonding conditions to establish a correlation between the interfacial microstructure and joint properties. It was found that the thickness of Ni3Nb layer and the remained Ni foil were beneficial to the joint shear strength. By changing Ni foil from 0 to 45â¯Î¼m, the shear strength was improved obviously, and then kept at around 250â¯MPa with further increasing Ni foil to 120â¯Î¼m. The maximum shear strength was 264â¯MPa when the joint was bonded at 1100â¯Â°C for 30min with 45â¯Î¼m Ni foil. Cracks were initiated from NiMo and Ni6Nb7 diffusion layers, and then propagated across the central diffusion layers.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 743, 30 April 2018, Pages 780-788
Journal: Journal of Alloys and Compounds - Volume 743, 30 April 2018, Pages 780-788
نویسندگان
J.M. Lin, Z.W. Yang, H.H. Wei, Y. Wang, Z.Q. Ma, D.P. Wang,