کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
7995458 1516203 2017 17 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys
چکیده انگلیسی
Sn-34 wt%Bi, Sn-34 wt%Bi-2wt%Ag and Sn-34 wt%Bi-0.7 wt%Cu alloys have been directionally solidified (DS) under a broad range of solidification cooling rates. Microstructures have been characterized with emphasis on both eutectic growth and precipitation of Bi within the β-Sn dendritic matrix. The eutectic growth, for all alloys examined, is shown to be associated with the coexistence of coarse and fine lamellar structures with different length-scale of lamellar spacing (λ). Experimental growth relations of λ vs. the cooling rate have been proposed. The length-scale of the lamellae in the fine eutectic ranges from 0.8 to 2.5 μm while in the coarse eutectic from 1.8 to 4.0 μm. Taking as reference the Sn-Bi alloy, both the spacing between Bi precipitates (λp) and the fine eutectic spacing (λfine) increase with Cu and Ag additions, whereas λcoarse remains roughly unaltered. Both ternary Sn-Bi-Ag and Sn-Bi-Cu alloys are shown to have worse distributions of both lamellae in the fine eutectic and of precipitates within Sn-rich dendrites, which resulted in decrease in hardness.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 691, 15 January 2017, Pages 600-605
نویسندگان
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