On the Cu-Ga system: Electromotive force measurement and thermodynamic reoptimization

The Cu-Sn-Ga system seems to be a promising lead free solder due to properties of gallium: excellent wetting and decreasing melting temperature of Cu-Sn lead-free solder. A new experimental measurement in a solid phase as well as a new thermodynamic description of this system is presented in this work. A good agreement between calculation and available experimental data was found.