کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
8023605 | 1517534 | 2018 | 31 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Oxidation barrier of Cu and Fe powder by Atomic Layer Deposition
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Oxidation barrier of Cu and Fe powder by Atomic Layer Deposition Oxidation barrier of Cu and Fe powder by Atomic Layer Deposition](/preview/png/8023605.png)
چکیده انگلیسی
Atomic Layer Deposition (ALD) is a vapor based technique which allows to deposit uniform, conformal films with a thickness control at the atomic scale. In this research, Al2O3 coatings were deposited on micrometer-sized Fe and Cu powder (particles) using the thermal trimethylaluminum (TMA)/water (H2O) process in a rotary pump-type ALD reactor. Rotation of the powder during deposition was required to obtain a pinhole-free ALD coating. The protective nature of the coating was evaluated by quantifying its effectiveness in protecting the metal particles during oxidative annealing treatments. The Al2O3 coated powders were annealed in ambient air while in-situ thermogravimetric analysis (TGA) and in-situ x-ray diffraction (XRD) data were acquired. The thermal stability of a series of Cu and Fe powder with different Al2O3 thicknesses were determined with TGA. In both samples a clear shift in oxidation temperature is visible. For Cu and Fe powder coated with 25â¯nm Al2O3, we observed an increase of the oxidation temperature with 300-400°C. For the Cu powder a thin film of only 8â¯nm is required to obtain an initial increase in oxidation temperature of 200°C. In contrast, for Fe powder a thicker coating of 25â¯nm is required. In both cases, the oxidation temperature increases with increasing thickness of the Al2O3 coating. These results illustrate that the Al2O3 thin film, deposited by the thermal ALD process (TMA/H2O) can be an efficient and pinhole-free barrier layer for micrometer-sized powder particles, provided that the powder is properly agitated during the process to ensure sufficient vapor-solid interaction.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Surface and Coatings Technology - Volume 349, 15 September 2018, Pages 1032-1041
Journal: Surface and Coatings Technology - Volume 349, 15 September 2018, Pages 1032-1041
نویسندگان
Véronique Cremers, Geert Rampelberg, Ahmed Barhoum, Perry Walters, Nathalie Claes, Thais Milagres de Oliveira, Guy Van Assche, Sara Bals, Jolien Dendooven, Christophe Detavernier,