Measurement of the Young's modulus of moulding compounds at elevated temperatures with a resonance method

It has already been shown that it is possible to measure the Young's modulus of moulding compounds used for encapsulation of microelectronic devices with the impulse excitation technique at room temperature. For calculations and simulations of the thermo-mechanical stability of microelectronic devices during soldering it is also necessary to know the Young's modulus at higher temperatures up to 260 °C. Investigations with the three-point bending method are even more time and material consuming than the measurements at room temperature. Therefore, we built a setup to allow measurements of the Young's modulus in a temperature range from room temperature up to 260 °C. Investigations of the Young's modulus of four different moulding compounds are reported and compared with data from three-point bending tests.