Back flash imprint lithography for transparent plastic substrates

A new and low-cost process, back flash imprint lithography (BFIL), has been developed for use in resist pattern transfer on flexible transparent plastic substrates. This technique uses a two-layer plate, which contains a transparent plastic substrate coated with an UV-curable resist. The plate is heated over the resist's softening point. Then a non-transparent mold is pressed to the resist layer. After cooling to room temperature, an UV-light is applied from the substrate side to photocure the resist. After the separation of mold and the resist layer, the desired patterns can be transferred to the resist completely.