کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9675980 | 1454111 | 2005 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Electroless plating of copper through successive pretreatment with silane and colloidal silver
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
شیمی کلوئیدی و سطحی
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چکیده انگلیسی
We report a method to perform electroless copper plating on glass that could generate a solid copper film. In this method, γ-mercaptopropyltrimethoxysilane (MPTS) was used to form self-assembled molecular layers on commercially available glass slides, which were subsequently activated by dipping them directly into colloidal Ag solution instead of conventional two-step method, SnCl2 sensitization followed by PdCl2 activation, and applied successfully for electroless Cu plating. Experimental characterizations showed that a thin layer of Ag colloids was anchored onto the glass surface through SAg bonds, resulting a quicker deposition of copper metal and a stronger adherence of copper film on MPTS-modified glass surface than those on conventional two-step modified glass.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Colloids and Surfaces A: Physicochemical and Engineering Aspects - Volumes 257â258, 5 May 2005, Pages 283-286
Journal: Colloids and Surfaces A: Physicochemical and Engineering Aspects - Volumes 257â258, 5 May 2005, Pages 283-286
نویسندگان
Zheng-Chun Liu, Quan-Guo He, Peng Hou, Peng-Feng Xiao, Nong-Yue He, Zu-Hong Lu,