کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
9803925 1516475 2005 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Control of compound forming reaction at the interface between SnZn solder and Cu substrate
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
Control of compound forming reaction at the interface between SnZn solder and Cu substrate
چکیده انگلیسی
Effects of additives, Cu and Ni, on intermetallic compound formation at the interface between Sn-Zn-based solder and Cu substrate have been studied. (Sn91Zn9)99.98−xMxAl0.02 (wt.%) solder (M = Cu or Ni) alloys were prepared. The microstructures of the samples after annealing at 120 °C for 100 h were investigated using a scanning electron microscope, and the melting temperatures of the alloys were measured with a differential scanning calorimeter for different Cu or Ni contents. Although the melting (liquidus) temperature increases up to about 210-220 °C by alloying Cu or Ni of 2.6-2.7 wt.% to the solder, the well-known formation of intermetallic compounds, Cu5Zn8 and Sn6Cu5, are found to be significantly restrained.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 392, Issues 1–2, 19 April 2005, Pages 200-205
نویسندگان
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