کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
9803925 | 1516475 | 2005 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Control of compound forming reaction at the interface between SnZn solder and Cu substrate
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
Effects of additives, Cu and Ni, on intermetallic compound formation at the interface between Sn-Zn-based solder and Cu substrate have been studied. (Sn91Zn9)99.98âxMxAl0.02 (wt.%) solder (M = Cu or Ni) alloys were prepared. The microstructures of the samples after annealing at 120 °C for 100 h were investigated using a scanning electron microscope, and the melting temperatures of the alloys were measured with a differential scanning calorimeter for different Cu or Ni contents. Although the melting (liquidus) temperature increases up to about 210-220 °C by alloying Cu or Ni of 2.6-2.7 wt.% to the solder, the well-known formation of intermetallic compounds, Cu5Zn8 and Sn6Cu5, are found to be significantly restrained.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 392, Issues 1â2, 19 April 2005, Pages 200-205
Journal: Journal of Alloys and Compounds - Volume 392, Issues 1â2, 19 April 2005, Pages 200-205
نویسندگان
Tetsu Ichitsubo, Eiichiro Matsubara, Kozo Fujiwara, Masahiko Yamaguchi, Hisao Irie, Seishi Kumamoto, Takaaki Anada,