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Daneshyari Hardware and Architecture Journas Latest Articles

Hardware and Architecture Research Articles

Whisker growth on tin finishes of different electrolytes
Fulltext Access 6 Pages 2008
Nanostructures, magnetic semiconductors and spintronics
Fulltext Access 6 Pages 2008
Reservoir effect in SiCN capped copper/SiO2 interconnects
Fulltext Access 6 Pages 2008
The application of polyimide/silicon nitride dual passivation to AlxGa1−xN/GaN high electron mobility transistors
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Influence of sidewall spacer on threshold voltage of MOSFET with high-k gate dielectric
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Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging
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dc-Conduction mechanism in lanthanum–manganese oxide films grown on p-Si substrate
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Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering
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Suppression of Ge–O and Ge–N bonding at Ge–HfO2 and Ge–TiO2 interfaces by deposition onto plasma-nitrided passivated Ge substrates: Integration issues Ge gate stacks into advanced devices
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A junction characterization for microelectronic devices quality and reliability
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A new model of subthreshold swing for sub-100 nm MOSFETs
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Structural design optimization for board-level drop reliability of wafer-level chip-scale packages
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Bulk built in current sensors for single event transient detection in deep-submicron technologies
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Force-fed evaporation and condensation utilizing advanced micro-structured surfaces and micro-channels
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Electro-thermal modeling of multifinger AlGaN/GaN HEMT device operation including thermal substrate effects
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A 2D threshold-voltage model for small MOSFET with quantum-mechanical effects
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A threshold voltage model for short-channel MOSFETs taking into account the varying depth of channel depletion layers around the source and drain
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Failure analysis of contact probe pins for SnPb and Sn applications
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Microchannel fabrication process in LTCC ceramics
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Investigation on a new silver photoimageable conductor
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Transient analysis on hygroscopic swelling characterization using sequentially coupled moisture diffusion and hygroscopic stress modeling method
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Signal probability for reliability evaluation of logic circuits
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Voltage-based fault path tracing by transistor operating point analysis
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Analytical model for multi-junction solar cells prediction in space environment
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Thermal resistance assessment in multi-trenched power devices
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A novel current reference based on subthreshold MOSFETs with high PSRR
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Improved sensing characteristics of MISiC Schottky-diode hydrogen sensor by using HfO2 as gate insulator
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A novel approach to characterization of progressive breakdown in high-k/metal gate stacks
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Exciton states in wurtzite and zinc-blende InGaN/GaN coupled quantum dots
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Shielding region effects on a trench gate IGBT
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Design of adaptive supply voltage for sub-threshold logic based on sub-1 V bandgap reference circuit
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Non-ideal behavior of a driving resonator loop in a vibratory capacitive microgyroscope
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A 1.2 V current-mode true RMS–DC converter based on the floating gate MOS translinear principle
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Atom-like behaviors and orbital-related Tomonaga-Luttinger liquids in carbon nano-peapod quantum dots
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Landscape phage as a molecular recognition interface for detection devices
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Towards atomic-scale design: A theoretical investigation of magnetic nanoparticles and ultrathin films
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Bottom-up approach to silicon nanoelectronics
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High-Tc superconductivity in entirely end-bonded multi-walled carbon nanotubes
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Comparison between changes of ultracapacitors model parameters during calendar life and power cycling ageing tests
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Test response reuse-based SoC core test compression and test scheduling for test application time minimization
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Design formula for band-switching capacitor array in wide tuning range low-phase-noise LC-VCO
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Experimental characterization and numerical analysis of the 4H-SiC p–i–n diodes static and transient behaviour
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A probabilistic design optimization for MEMS tunable capacitors
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High-performance PIN photodiodes on TMAH thinned silicon wafers
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Effect of the interface states on the cell parameters of a thin film quasi-monocrystalline porous silicon as an active layer
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Chirp compression with single chirped mirrors and its assembly
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Semiconductor terahertz detectors and absorption enhancement using plasmons
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Silicon in functional epitaxial oxides: A new group of nanostructures
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Polaron effects on the energy of a hydrogenic donor impurity in GaAs–(Ga,Al)As quantum-well wires
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Miniband properties of superlattice quantum dot arrays fabricated by the edge-defined nanowires
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Monitoring of carrier lifetime distribution in high power semiconductor device technology
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The interface states analysis of the MIS structure as a function of frequency
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Microstructure of eutectic 80Au/20Sn solder joint in laser diode package
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High density self assembled nanoparticle film with temperature-controllable interparticle spacing for deep sub-wavelength nanolithography using localized surface plasmon modes on planar silver nanoparticle tunable grating
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A novel fabrication process of MEMS devices on polyimide flexible substrates
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Metal direct nanoimprinting for photonics
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Investigation of the doping and thickness effects of polysilicon oxide by rapid thermal N2O oxidation
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Characterization of sputtered tungsten nitride film and its application to Cu electroless plating
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The frequency and voltage dependent electrical characteristics of Al–TiW–Pd2Si/n-Si structure using I–V, C–V and G/ω–V measurements
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On the temperature dependence of series resistance and interface states in Al/SiO2/p-Si (MIS) Schottky diodes
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Some electrical properties of polyaniline/p-Si/Al structure at 300 K and 77 K temperatures
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Superjunction LDMOS on thick-SOI technology for RF applications
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A new fault current-sensing scheme for fast fault protection of the insulated gate bipolar transistor
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Temperature dependence of the dielectric properties of polymer composite based RF capacitors
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Dynamic avalanche in diodes with local lifetime control by means of palladium
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Reliability of reverse properties of power semiconductor devices:: Influence of surface dielectric layer and its experimental verification
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Design methodology for configurable analog to digital conversion using support vector machines
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Stark effect of electrons in semiconducting rectangular quantum boxes
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Piezoresistive effect in GaAs/InxGa1−xAs/AlAs resonant tunneling diodes for application in micromechanical sensors
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A circuit-compatible analytical device model for ballistic nanowire transistors
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Micro FET pressure sensor manufactured using CMOS-MEMS technique
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Fabrication of a new micro bio chip and flow cell cytometry system using Bio-MEMS technology
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Center embossed diaphragm design guidelines and Fabry–Perot diaphragm fiber optic sensor
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Study on TiO2-doped ZnO thick film gas sensors enhanced by UV light at room temperature
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Electric field-enhanced metal-induced lateral crystallization and P-channel poly-Si TFTs fabricated by it
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Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact
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Performance and reliability testing of modern IGBT devices under typical operating conditions of aeronautic applications
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Layout analysis as supporting tool for failure localization: Basic principles and case studies
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Effect of physical defect on shmoos in CMOS DSM technologies
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Timing analysis of scan design integrated circuits using stimulation by an infrared diode laser in externally triggered pulsing condition
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Reliability assessment of integrated power transistors: Lateral DMOS versus vertical DMOS
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Conditional time resolved photoemission for debugging ICs with intermittent faults
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Fast and rigorous use of thermal time constant to characterize back end of the line test structure in advanced technology
Fulltext Access 6 Pages 2008
Advanced thermal failure analysis and reliability investigations – Industrial demands and related limitations
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Charging and discharging phenomena in electrostatically-driven single-crystal-silicon MEM resonators: DC bias dependence and influence on the series resonance frequency
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Reliability investigations of 850 nm silicon photodiodes under proton irradiation for space applications
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Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150 °C
Fulltext Access 6 Pages 2008
Ball grid array (BGA) solder joint intermittency real-time detection
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Transmission-line-matrix (TLM) modeling of self-heating in AlGaN/GaN transistor structures
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Reliability issues of e-Cubes heterogeneous system integration
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Systems-in-foil – Devices, fabrication processes and reliability issues
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Failure analysis of pad-height effects in the fine-pitch interconnection of the anisotropic conductive films
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Temperature dependence of electrical parameters of SMD ferrite components for EMI suppression
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Simulation of transient thermal states in layered electronic microstructures
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Noise and reliability in simulated thin metal films
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Characterization of defects in flexible circuits with ultrasonic atomic force microscopy
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Accurate negative bias temperature instability lifetime prediction based on hole injection
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Leakage currents and dielectric breakdown of Si1−x−yGexCy thermal oxides
Fulltext Access 6 Pages 2008
Study and formation of 2D microstructures of sapphire by focused ion beam milling
Fulltext Access 6 Pages 2008
A simple method for high yield fabrication of sharp silicon tips
Fulltext Access 6 Pages 2008
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