Keywords: خود انلینگ; Copper; Grain growth; Hardness; High-pressure torsion; Self-annealing;
مقالات ISI خود انلینگ (ترجمه نشده)
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Keywords: خود انلینگ; Severe plastic deformation (SPD); Liquid nitrogen; Ultrafine-grained (UFG) materials; Self-annealing; Stacking fault energy; Homologous temperature;
TEM characterization of Cu self-annealing and direct proof of pinhole formation mechanism in a Cu film
Keywords: خود انلینگ; Electroplated Cu; Self-annealing; Pinhole; Nanochannel; Grain transformation kinetics; TEM;
On convergence and parameter selection of the EM and DA-EM algorithms for Gaussian mixtures
Keywords: خود انلینگ; Expectation & maximization (EM) algorithm; Deterministic annealing EM (DA-EM); GAUSSIAN mixtures; Self-annealing; Convergence; Parameter selection;
Microstructure and physical properties of sputter-deposited Cu-Mo thin films
Keywords: خود انلینگ; Thin films; Cu-Mo system; Microstructure; Physical properties; Self-annealing;
Comparisons of self-annealing behaviour of HPT-processed high purity Cu and a Pb-Sn alloy
Keywords: خود انلینگ; High-pressure torsion; High purity Cu; Pb-62%Sn alloy; Self-annealing;
Change of Crystallographic Orientation Characteristics of (001)-Oriented Electrodeposited Silver Films During Self-Annealing at Room Temperature
Keywords: خود انلینگ; Electrodeposited silver film; Self-annealing; Electron back scatter diffraction patterns; In situ observation; Crystal orientation;
Depth-dependent self-annealing behavior of electroplated Cu
Keywords: خود انلینگ; Electroplated Cu; Self-annealing; Bottom-up grain growth; EBSD; TOF-SIMS;
In-situ study on the self-annealing behavior of electroplated Cu through the cantilever method, XRD, and EBSD
Keywords: خود انلینگ; Electroplated Cu; Self-annealing; Internal stress/strain; Crystallographic orientation; Grain orientation spread (GOS)
Formation mechanism of pinholes in electroplated Cu films and its mitigation
Keywords: خود انلینگ; Electroplated Cu; Pinhole; Impurity; Self-annealing; EBSD; TOF-SIMS
Crystallographic study on self-annealing of electroplated copper at room temperature
Keywords: خود انلینگ; Copper; Electroplating; Self-annealing; EBSD; XRD
Resistivity-microstructure correlation of self-annealed electrodeposited copper thin films
Keywords: خود انلینگ; Electrodeposition; Self-annealing; Recrystallization; In situ EBSD
Microstructure in copper interconnects – Influence of plating additive concentration
Keywords: خود انلینگ; Copper; Electrochemical deposition; Additive concentration; Self-annealing; Grain growth
Interpretation of texture changes during self-annealing of electroplated copper
Keywords: خود انلینگ; Self-annealing; Electroplated copper; Texture evolution; X-ray diffraction (XRD); Electron backscattering diffraction (EBSD)
The kinetics and mechanism of room-temperature microstructural evolution in electroplated copper foils
Keywords: خود انلینگ; Electroplated copper; Self-annealing; Microstructural evolution; Activation energy
Influence of initial microstructure and impurities on Cu room-temperature recrystallization (self-annealing)
Keywords: خود انلینگ; 81.15.Pq; 82.45.Mp; 82.80.Ms; 85.40.Ls; 91.60.EdCopper; Self-annealing; Microstructure; Texture; EBSD; Impurities
Investigation of organic impurities adsorbed on and incorporated into electroplated copper layers
Keywords: خود انلینگ; 61.72.Ss; 66.30.Jt; 68.35.Dv; 81.15.Pq; 82.45.Vp; 85.40.Ls; Electroplating; Copper; Self-annealing; Additives; Surface contamination; GD-OES;
Self-annealing and aging effect characterization on copper seed thin films
Keywords: خود انلینگ; Copper; Seed; Self-annealing; Seed-aging; Reflectivity;
Characterization of electroplated copper self-annealing with investigations focused on incorporated impurities
Keywords: خود انلینگ; 61.72.Ss; 66.30.Jt; 68.35.Dv; 81.15.Pq; 82.45.Vp; 83.85.St; 85.40.Ls; Electrochemical deposition; Copper; Self-annealing; Additives; Stress; Impurity diffusion; GD-OES;