Keywords: از طریق سیلیکن (TSV); Spectroscopic reflectometry; Through silicon via (TSV); Bosch etching process; Scallop; RCWA; Etch depth
مقالات ISI از طریق سیلیکن (TSV) (ترجمه نشده)
مقالات زیر هنوز به فارسی ترجمه نشده اند.
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در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Effects of SiO2 film thickness and operating temperature on thermally-induced failures in through-silicon-via structures
Keywords: از طریق سیلیکن (TSV); Through silicon via (TSV); Thermally-induced failure; Electrical current breakdown;
Power Efficient 3D Clock Distribution Network Design with TSV Count Optimization
Keywords: از طریق سیلیکن (TSV); through silicon via (TSV); merging cost; 3D abstract clock tree; buffering.
Validation of TSV thermo-mechanical simulation by stress measurement
Keywords: از طریق سیلیکن (TSV); Through silicon via (TSV); Thermal stress measurement; Raman spectroscopy; FEM simulation;
Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration
Keywords: از طریق سیلیکن (TSV); 3D integration; Through silicon via (TSV); Transmission line; Electrical measurement; RF characterization
Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums
Keywords: از طریق سیلیکن (TSV); Through Silicon Via (TSV); copper electrodeposition; leveler; choline; bottom-up filling
An efficient and simple compact modeling approach for 3-D interconnects with IC׳s stack global electrical context consideration
Keywords: از طریق سیلیکن (TSV); 3D integrated circuits; Through Silicon Via (TSV); Compact modeling including electrical context; CPW; TSVs chains.
In-line through silicon vias etching depths inspection by spectroscopic reflectometry
Keywords: از طریق سیلیکن (TSV); Spectroscopic reflectometry; Through silicon via (TSV); Rigorous coupled wave analysis (RCWA); Etch depth
Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias
Keywords: از طریق سیلیکن (TSV); Through Silicon via (TSV); Copper diffusion; Barrier; TiN; MOCVD; Step-coverage
An investigation into warpages, stresses and keep-out zone in 3D through-silicon-via DRAM packages
Keywords: از طریق سیلیکن (TSV); Through silicon via (TSV); Warpage; Keep-out zone (KOZ); Mobility change; Stress; 3D IC package;
Copper seed layer repair using an electroplating process for through silicon via metallization
Keywords: از طریق سیلیکن (TSV); Through silicon via (TSV); Copper seed layer; Copper electroplating
Simulation and fabrication of two Cu TSV electroplating methods for wafer-level 3D integrated circuits packaging
Keywords: از طریق سیلیکن (TSV); Through silicon via (TSV); Cu electroplating; Simulation; Wafer-level; Double-sided; Bottom-up
Investigations regarding Through Silicon Via filling for 3D integration by Periodic Pulse Reverse plating with and without additives
Keywords: از طریق سیلیکن (TSV); Through Silicon Via (TSV); Electrochemical deposition (ECD); Copper; Periodic Pulse Reverse (PPR) plating
Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration
Keywords: از طریق سیلیکن (TSV); Through Silicon Via (TSV); 3D integration; Metallization
Development of a BGA Package Based on Si Interposer with Through Silicon Via
Keywords: از طریق سیلیکن (TSV); ball grid array (BGA); through silicon via (TSV); Si interposer; thermal modeling;
Multi-layer floorplanning for stacked ICs: Configuration number and fixed-outline constraints
Keywords: از طریق سیلیکن (TSV); 3-D ICs; Through silicon via (TSV); Floorplanning; Fixed-outline; Sequence pair