کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
541319 | 1450361 | 2014 | 6 صفحه PDF | دانلود رایگان |
![عکس صفحه اول مقاله: Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias](/preview/png/541319.png)
• The MOCVD TiN films are N-riched.
• Plasma treatment changes the films from amorphous to 7 nm crystal grain size.
• The films have larger gap in Ti and N concentration and contain less than 5% carbon.
• The plasma densification lowers the carbon content down to 2%.
• The step coverage is ⩾50% in 10 × 80 μm TSVs sidewall.
This article is related to the development of a new low temperature CVD titanium nitride deposition process for the formation of a copper diffusion barrier in 3D TSV integration, using a metalorganic precursor and NH3.The physicochemical properties of the film are studied on 300 mm silicon wafers deposited using a SPTS Technologies Sigma300 fxP™ deposition equipment. A design of experiments (DoEs) was carried out at 200 °C to check the influence of parameters such as reactor pressure, spacing (distance between the showerhead and the wafer), precursor/NH3 flow rate during deposition and NH3 flow rate during a subsequent densification plasma treatment. Responses including resistivity, uniformity, deposition rate and stress were measured. From this DoE, two process points are chosen according to expected material specifications requested from applications: a low resistivity process and a median conditions process. Then microstructure, the composition and stoichiometry of the film deposited with these process points are studied. Finally, the step coverage and continuity of the barrier in a high aspect ratio “through silicon via” (8:1, 10 μm diameter etched in 80 μm silicon) are measured and compared with a reference I-PVD process.
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Journal: Microelectronic Engineering - Volume 120, 25 May 2014, Pages 127–132