Exploratory study of copper particles electrodeposition on nickel by induction heating

► We study conventional (CH) vs. induction (IH) heating effect on Cu deposition on Ni. ► CH leads to a low coverage with weakly adherent copper microparticles. ► CH leads to a very large size distribution and uncontrolled morphology. ► IH leads to a high coverage of the surface with copper nanoparticles. ► IH leads to a sharp unimodal size repartition, controlled morphology and Cu2O shell.