Surface protection of copper in acid medium by azoles and surfactants

The influence of derivatives of 1,2,4 triazole, 3-amino 1,2,4-traizole (ATA), 3-amino 5-mercapto 1,2,4 triazole (AMT) and 3-amino 5-methylthio 1,2,4 triazole (AMTT) and ionic surfactants cetyl trimethyl ammonium bromide (CTAB) and sodium dodecyl sulphate (SDS) on the corrosion control of copper in acidic solution was investigated by gravimetric and electrochemical methods. The combined effect of triazoles and surfactants was also evaluated. Electrochemical parameters like corrosion potentials corrosion current density, corrosion rates and inhibition efficiencies were determined. The results reveal the fact that of all triazoles AMTT shows best inhibition and anionic surfactant SDS protects the surface better than the cationic surfactant CTAB. The polarisation data reveal that all inhibitors behave as a mixed type inhibitor. Adsorption of these inhibitors on the surface of copper is found to obey the Langmuir adsorption isotherm. A marked inhibition synergism effect is shown by all the combinations of triazole and surfactant.