Finite element analysis of miniature thermoelectric coolers with high cooling performance and short response time

The miniature thermoelectric cooler (TEC) is a promising device for microelectronics applications with high cooling performance and short response time. In this paper, a comprehensive numerical analysis focusing on the cooling performance and response time of the TEC is performed by finite element methods (FEMs). The effects of load current, geometric size, ratio of length to cross-sectional area and substrate's thermal resistance on the performance of the TEC are studied. The results show that the performance of TECs has been improved by reducing the TEC's size and ratio of length to cross-sectional area, resulting in a maximum cooling temperature difference of 88 °C, a cooling power density of 1000 W cm−2 and a short response time on the order of milliseconds. Furthermore, the substrate, which hinders the circulation of heat between the TEC and the atmosphere, also has a significant influence on the performance of the TEC.