کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1389865 | 982933 | 2007 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Application of saccharose as copper(II) ligand for electroless copper plating solutions
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی آلی
پیش نمایش صفحه اول مقاله
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چکیده انگلیسی
Saccharose, forming sufficiently stable complexes with copper(II) ions in alkaline solutions, was found to be a suitable ligand for copper(II) chelating in alkaline (pH > 12) electroless copper deposition solutions. Reduction of copper(II)–saccharose complexes by hydrated formaldehyde was investigated and the copper deposits formed were characterized. The thickness of the compact copper coatings obtained under optimal operating conditions in 1 h reaches ca. 2 μm at ambient temperature. The plating solutions were stable and no signs of Cu(II) reduction in the bulk solution were observed. Results were compared with those systems operating with other copper(II) ligands.
CuSa(OH)32-+2HCHO+OH-→CuCu+H2+2HCOO-+2H2O+Sa-
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Carbohydrate Research - Volume 342, Issue 1, 15 January 2007, Pages 71–78
Journal: Carbohydrate Research - Volume 342, Issue 1, 15 January 2007, Pages 71–78
نویسندگان
Eugenijus Norkus, Kęstutis Prušinskas, Algirdas Vaškelis, Janė Jačiauskienė, Irena Stalnionienė, Donald L. Macalady,