Dynamic recovery in nanocrystalline Ni

The constant flow stress reached during uniaxial deformation of electrodeposited nanocrystalline Ni reflects a quasi-stationary balance between dislocation slip and grain boundary (GB) accommodation mechanisms. Stress reduction tests allow to suppress dislocation slip and bring recovery mechanisms into the foreground. When combined with in situ X-ray diffraction it can be shown that grain boundary recovery mechanisms play an important role in producing plastic strain while hardening the microstructure. This result has a significant consequence for the parameters of thermally activated glide of dislocations, such as athermal stress and activation volume, which are traditionally derived from stress/strain rate change tests.