کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1446169 | 988600 | 2013 | 10 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Mapping type III intragranular residual stress distributions in deformed copper polycrystals
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Cross-correlation-based analysis of electron backscatter diffraction patterns has been used to map the intragranular residual stress variations in polycrystalline copper samples deformed to different plastic strain levels of 0%, 2%, 6% and 10%. We map the deviation from the mean stress within each grain and present histograms of stress levels mapped over many grains which show a central Gaussian-like peak with non-Gaussian tails at the higher stress magnitudes. The width of the peaks increased with increasing plastic deformation and the tails became more obvious. Plots correlating maximum in-plane shear stress and distance to the nearest grain boundary demonstrate that stress “hot spots” tend to accumulate near grain boundaries.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Acta Materialia - Volume 61, Issue 15, September 2013, Pages 5895–5904
Journal: Acta Materialia - Volume 61, Issue 15, September 2013, Pages 5895–5904
نویسندگان
Jun Jiang, T. Benjamin Britton, Angus J. Wilkinson,