کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1447148 988636 2011 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Triple junction effects in solids
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
Triple junction effects in solids
چکیده انگلیسی

The grain boundary–free surface triple line tension and grain boundary triple line tension were investigated in copper using a recently introduced novel approach. The effect of triple line tension on grain growth, Zener drag and Gibbs–Thompson relation was studied. The results showed that the triple line tension has a considerable effect on grain growth, particle–boundary interactions and void shape, especially for nanocrystalline materials.


► The effect of triple junctions on a variety of metallurgical phenomena was investigated.
► For copper the groove root triple line energy was determined as 1.5 E-8 J/m.
► For copper the grain boundary triple line energy was determined as 6 E-9 J/m
► In nanocrystalline materials the triple line energy contributes to the driving force for grain growth. The triple line energy prevents a grain boundary to wet nanoscopic particles and voids.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Acta Materialia - Volume 59, Issue 9, May 2011, Pages 3510–3518
نویسندگان
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