کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1447400 988643 2010 11 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Early stages of intermetallic compound formation and growth during lead-free soldering
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
Early stages of intermetallic compound formation and growth during lead-free soldering
چکیده انگلیسی

We investigate the early stages of the morphological evolution of intermetallic compounds (IMCs) during lead-free soldering involving liquid Sn-based solder and Cu substrate considering the heterogeneous nucleation of the IMCs. The simulation is performed through the multi-phase-field approach [20] and [25]. Initially, the liquid Sn-based solder and the Cu substrate are considered to be at metastable local equilibrium. Nucleation at the solder/substrate interface is modeled by considering it to be a Poisson process. The phase-field simulation accounts for variations in grain boundary diffusion in the η phase and interface energies between the η phase and liquid solder, and uses these variations to investigate the multiplicity of soldering reactions, and make comparisons with previous work [23]. The simulations address the kinetics of the IMC growth during lead-free soldering under the effect of nucleation at an early stage, illustrating the variation in Cu substrate thickness, IMC thickness and number of grains that nucleate or disappear due to grain growth-induced coalescence.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Acta Materialia - Volume 58, Issue 14, August 2010, Pages 4900–4910
نویسندگان
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