کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1448948 988687 2010 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Scaling the response of microscale compression molding of elemental Cu in the presence of dynamic recrystallization
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
Scaling the response of microscale compression molding of elemental Cu in the presence of dynamic recrystallization
چکیده انگلیسی

Replication of metallic high-aspect-ratio microscale structures by direct compression molding is a promising microfabrication technique. In this paper, the micromolding response of elemental Cu is measured as a function of molding temperature. Companion tensile testing of macroscale Cu specimens was carried out at the corresponding molding temperatures. Microstructures of tensile tested macroscale Cu specimens and molded Cu specimens were characterized by combining focused ion beam (FIB) sectioning and imaging with ion-induced secondary electrons (ISEs). At all temperatures tested, measured tensile stress–strain curves for Cu show clear evidence for the occurrence of dynamic recrystallization (DRX) within macroscale tensile specimens. Additional FIB sectioning and imaging with ISEs of molded Cu specimens provide microstructural evidence for the occurrence of DRX during molding. The present results show that, even in the presence of DRX, an appropriate one-parameter scaling continues to reduce the molding response to a universal function independent of the molding temperature.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Acta Materialia - Volume 58, Issue 7, April 2010, Pages 2638–2645
نویسندگان
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