Three-dimensional simulation of intermetallic compound layer growth in a binary alloy system

We present three-dimensional phase-field simulations of the thickening of intermetallic compound (IMC) layers and their microstructural evolution during soldering and aging in a binary alloy system. The focus was on the grain growth in the IMC layer, since the grain boundary (GB) provides a high-diffusivity path and affects the thickening kinetics of the IMC. The radial grain growth of the IMC was analogous to Ostwald ripening when the phase interface was rounded, while it followed normal grain growth with planar phase interface. The thickening mode of the IMC layer was dependent upon the microstructural evolution within the IMC layer with high diffusivity along the GBs. The simulation results successfully confirm literature models on the effect of GB diffusion on IMC thickening.