An alternate theoretical approach to solid-state bonding

A novel physical explanation for solid-state bonding is presented, which yields closed-form equations relating the bonding progression with time, temperature, applied pressure and the constants characterizing the material. Excellent agreement with experiment is attained, with no adjustable parameter. In the novel scheme, diffusion bonding is caused by the interpenetration of the two surfaces at the grain level. The process is driven by the strong tensile stress field induced in the plane of the interface by the plastic deformation.