An overview on packaging of microwave electronic devices operating in a cryogenic environment

Microwave cryogenic electronics design involves not only electrical, RF and electromagnetically considerations but also mechanical and assembly aspects. Details heavily influence the final device performances. Radio astronomical science often requires cooling down front end parts of the receivers in order to increase the system sensitivity. In this paper we will introduce the device working environment, crucial aspects of the housing, and we will describe a variety of possible solutions.

► Adeguate joint stress control required by cryogenic MMICs.
► Low CTE alloys had been proven to house MMICs.
► Flexible adhesive had been tested.