Controlling floating body effect in high temperatures: L-shape SiGe region in nano-scale MOSFET

In this paper a new technique for controlling floating body effect and self-heating effects is proposed. The main idea in the proposed structure is using a L-shape SiGe region in the nano-scale SOI-MOSFET (LS-SOI). The L-shape SiGe region is located in the source region and is extended under channel. The difference band gap between silicon and silicon-germanium cause discontinuity in band diagram which helps to collect channel holes. Reducing the hole density in channel of the proposed LS-SOI in comparison to conventional SOI-MOSFET (C-SOI) results in suppressed floating body effect. Also, the SiGe region under the channel decreases the lattice temperature in the LS-SOI. Replacing the SiGe with higher thermal capability than buried oxide is useful to have a reliable structure. Moreover, effective mobility, off current and sub-threshold swing improves in the proposed structure.