The effect of a surface layer capping p-InGaN/p-GaN superlattices on the contact to p-GaN

In this study, the influence of the surface layer (p-InGaN or p-GaN) capping p-InGaN/p-GaN superlattices (SLs) on the contact to p-type GaN was investigated. It was found that the specific contact resistance (ρc)(ρc) to p-type GaN is lower when using p-InGaN as the surface layer. The lowest value of ρcρc was 1.99×10−4 Ω cm2 at room temperature. It was also found that low temperature growth of the p-GaN layers in the SLs is beneficial for lowering the ohmic contact resistance. Unlike Ni/Au deposited directly on p-GaN (without the strained p-InGaN/p-GaN SLs), Ni/Au deposited on p-InGaN/p-GaN SLs produces ohmic behavior even before annealing.