کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1570948 | 1514397 | 2014 | 10 صفحه PDF | دانلود رایگان |
Transmission electron microscopy (TEM) examinations on as-received, cold worked, as well as cold worked and creep tested phosphorus-alloyed oxygen-free copper (Cu-OFP) have been carried out to study the role of the cell structure. The cell size decreased linearly with increasing plastic deformation in tension. The flow stress in the tests could also be correlated to the cell size. The observed relation between the flow stress and the cell size was in excellent agreement with previously published results. The dense dislocation walls that appeared after cold work in tension is likely to be the main reason for the dramatic increase in creep strength. The dense dislocation walls act as barriers against dislocation motion and their presence also reduces the recovery rate due to an unbalanced dislocation content.
Journal: Materials Characterization - Volume 90, April 2014, Pages 21–30