High-temperature bonding performance of modified heat-resistant adhesive for ceramic connection

A modified polymer adhesive characterized by “one-time connection at low-temperature without post-treatment” was developed for joining mullite ceramic. Without pre-calcination, the bonding strength of cured adhesive maintained above 6.5 MPa during the whole heating process and even reached 24.8 MPa at 1300 °C. After pre-calcination at 1300 °C, the adhesive obtained the optimum bonding performance as much more heat-resistant ceramics and high-temperature melting glass generated in adhesive. Its bonding strength kept about 45 MPa during test from RT to 700 °C, while the value decreased to 28.5 MPa at 1300 °C because of the melting of newly-formed glass. With increasing thermal-cycling times at 1300 °C, the value could maintain at about 35.2 MPa.