Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets

Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 656, 25 January 2016, Pages 500-509

Guang Chen, Fengshun Wu, Changqing Liu, Vadim V. Silberschmidt, Y.C. Chan,