کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1609724 1516264 2015 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Enhanced pressure-free bonding using mixture of Cu and NiO nanoparticles
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
Enhanced pressure-free bonding using mixture of Cu and NiO nanoparticles
چکیده انگلیسی
Pressure-free bonding using mixed Cu-NiO nanoparticles was examined. The effect of mixing NiO nanoparticles with Cu nanoparticles on bonding strength was identified for a NiO content between 0.005 and 2 wt%. The bonding layer, which presented a high bonding strength, was thin and dense. The Ni in the bonding layer was segregated at the surface and at grain boundaries of crystalline Cu grains as a metallic Cu-Ni alloy. These results suggest that the effect of the NiO addition is caused by the enhancement of sintering by surface diffusion in the bonding layer, resulting from sufficient removal of surface oxides on the Cu nanoparticles through their reaction with the NiO nanoparticles.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 629, 25 April 2015, Pages 118-123
نویسندگان
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