کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1609724 | 1516264 | 2015 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Enhanced pressure-free bonding using mixture of Cu and NiO nanoparticles
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
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چکیده انگلیسی
Pressure-free bonding using mixed Cu-NiO nanoparticles was examined. The effect of mixing NiO nanoparticles with Cu nanoparticles on bonding strength was identified for a NiO content between 0.005 and 2Â wt%. The bonding layer, which presented a high bonding strength, was thin and dense. The Ni in the bonding layer was segregated at the surface and at grain boundaries of crystalline Cu grains as a metallic Cu-Ni alloy. These results suggest that the effect of the NiO addition is caused by the enhancement of sintering by surface diffusion in the bonding layer, resulting from sufficient removal of surface oxides on the Cu nanoparticles through their reaction with the NiO nanoparticles.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 629, 25 April 2015, Pages 118-123
Journal: Journal of Alloys and Compounds - Volume 629, 25 April 2015, Pages 118-123
نویسندگان
Toshikazu Satoh, Toshitaka Ishizaki,