Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints in reflow process

► The microstructure and kinetics of IMC growth between SAC-xTiO2 and Cu were studied. ► Addition of small amounts TiO2 nanoparticles can suppress the growth of IMC layer. ► Nano-TiO2 addition can act as a grain refiner in the IMC formation and growth. ► The growth of the IMC layer is controlled through combined kinetics process.