Seeded growth of AlN on SiC substrates and defect characterization

In this study, seeded sublimation growth of aluminum nitride (AlN) on SiC substrates was investigated. Large diameter (15–20 mm) and thick (1–2 mm) AlN layers were demonstrated on Si-face, 3.5° off-axis 6H-SiC (0 0 0 1). A c-axis growth rate of 15–20 μm/h was achieved at 1830 °C, and the surface morphology was highly textured: step features were formed with a single facet on the top of the layer. High-resolution X-ray diffraction (HRXRD), X-ray photoelectron spectroscopy (XPS), and molten KOH/NaOH etching were employed to characterize the AlN layers. The AlN crystals grew highly orientated along the c-axis, however, the impurities of Si (3–6 at%) and C (5.9–8 at%) from the SiC changed the lattice constants of AlN and shifted the AlN (0 0 .2) 2θ value from pure AlN toward SiC. All the growth surfaces had Al-polarity and the dislocation density decreased from 108 to 106 cm−2 as the film thickness increased from 30 μm to 2 mm.