کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
187448 459643 2013 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی مهندسی شیمی (عمومی)
پیش نمایش صفحه اول مقاله
Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder
چکیده انگلیسی

The effects of an antioxidant, hydroquinone (HQ) and a grain refining additive, gelatin, on the electroplating characteristics of Sn–Bi alloys were investigated. Methane sulfonic acid (MSA) based plating baths with varying contents of additives were prepared and the electrochemical behavior of each bath was investigated. The combination of HQ and gelatin successfully reduces the deposition potential gap between the elements hence facilitates the co-deposition of Sn–Bi in this plating bath. Compact, adherent deposits could be obtained through the synergistic effects of these two additives. The electroplated Sn–Bi deposits showed a decrease in Bi content with increasing current density. Near eutectic Sn–60.75 wt.% Bi alloy was successfully deposited from the bath containing both HQ and gelatin at a current density of 18 mA cm−2.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Electrochimica Acta - Volume 90, 15 February 2013, Pages 265–273
نویسندگان
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