کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
189265 459676 2011 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Effect of copper pretreatment on the zincate process and subsequent electroplating of a protective copper/nickel deposit on the AZ91D magnesium alloy
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی مهندسی شیمی (عمومی)
پیش نمایش صفحه اول مقاله
Effect of copper pretreatment on the zincate process and subsequent electroplating of a protective copper/nickel deposit on the AZ91D magnesium alloy
چکیده انگلیسی

To obtain a durable Ni coating with excellent adhesion strength on an AZ91D Mg alloy, a pretreatment was performed with a small amount of Cu2+ ions added to the activation bath used in the pretreatment prior to the plating process. In the pretreatment activation process, a high density Cu layer was deposited on both the α-phase and β-phase areas of the substrate accompanied with Mg dissolution. The Cu deposit acted as nucleation seeds for the Zn deposition in the following zincate process which provided a uniform and dense Zn layer almost completely covering the substrate. Then a thin Cu layer was electroplated on this zincated substrate as an undercoating for the succeeding electroplating with Ni. Cross-sectional scanning electron microscopy observations showed that the Cu deposited by the pretreatment enabled the deposition of a protective Ni layer with few defects. This structure also contributed to the improvement of adhesion strength and corrosion resistance as compared with the non-Cu added sample.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Electrochimica Acta - Volume 56, Issue 24, 1 October 2011, Pages 8776–8782
نویسندگان
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