Effects of solution temperature on the kinetic nature of passive film on Ni

Effects of solution temperature on the kinetic nature of passive film on Ni were investigated using polarization test, Mott–Schottky analysis and electrochemical impedance spectroscopy to reveal why the corrosion resistance of Ni is degraded with an increase in solution temperature. The increase in the corrosion rate of Ni with solution temperature was confirmed by the increase in the passive current density and also in the steady-state current density. Mott–Schottky analysis revealed that the passive film formed on Ni exhibits a p-type semiconducting characteristics irrespective of the solution temperature, and the concentration of cation vacancy in the passive film increases with temperature. By optimizing the reduced PDM (point defect model) on the experimental impedance data, base rate constants and transfer coefficients for the charge transfer reactions occurring at the metal/film and film/solution interfaces were extracted, and the Warburg coefficient for the cation vacancy transport was also determined. According to the calculated kinetic parameters (rate constants for the interfacial reactions, diffusivity of cation vacancy, etc.), the mechanism for the degradation of corrosion resistance of Ni with solution temperature was explained.