Fabrication of nanopatterned metal layers on silicon by nanoindentation/nanoscratching and electrodeposition

The present work illustrates a novel approach for the maskless and resistless fabrication of nanopatterned metal layers on Si substrates, based on the combination of nanomechanical surface modification techniques (such as nanoindentation and nanoscratching) and electrodeposition. Single crystal (1 0 0) n-doped Si substrates were first cleaned from native oxide. Nanoindentation and nanoscratching were then used to locally change the substrate microstructure and create regions with reduced electrical conductivity. The substrates were finally mounted as cathode electrodes in a three-electrode electrochemical cell to potentiostatically deposit a Ni layer. Electrodeposition was prevented in regions with modified microstructure, enabling the formation of a patterned Ni layer. The fabrication of several patterns including continuous Ni lines of 200 nm width and several microns length was obtained.