کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
539016 1450330 2016 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Analytical and finite element modeling of through glass via thermal stress
ترجمه فارسی عنوان
مدلسازی عناصر تحلیلی و محدود از طریق شیشه از طریق استرس حرارتی
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
چکیده انگلیسی


• An analytical model of TGV was developed to enhance the performance of interconnections in 3D packages.
• The analytical models represent the thermal stress in terms of different geometrical parameters.
• Three dimensional Finite Element Models were carried out in order to simulate the thermal stresses.
• The meshing size and boundary condition were carefully selected and applied to get accurate results out of simulations.
• A side by side comparison of the analytical model and finite element results showed an agreement.

This paper presents a thermomechanical study of the stresses which eventually occur in through glass vias (TGVs) due to the coefficient of thermal expansion (CTE) mismatch. The objective of the analysis is to assess the thermal stress variations in TGVs of different geometries. The main contribution of this paper is the elaboration of mathematical models to describe the thermomechanical stress in TGVs. To validate these models, a comparison with a linear finite element analysis (FEA) is carried out. The findings can be used to improve the reliability and engineering design in three-dimensional microelectronic packaging.

Figure optionsDownload as PowerPoint slide

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 151, 5 February 2016, Pages 12–18
نویسندگان
, , , , ,