کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
539965 1450370 2013 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Micro-compression test using non-tapered micro-pillar of electrodeposited Cu
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Micro-compression test using non-tapered micro-pillar of electrodeposited Cu
چکیده انگلیسی

We propose a novel method of mechanical test for measuring strength of electrodeposited Cu films using non-tapered micro-pillar. The grain size of each electrodeposited Cu films were changed by controlling current density and investigated by electron back scatter diffraction analysis. The pillars were fabricated by focused ion beam milling. The micro-compression test was carried out twice for each electrodeposition condition using a test machine designed for micro-sized specimen developed in our laboratory. The yield strength increased with increase of current density. The study showed that the influence of orientations on mechanical properties of the micro-sized specimens was magnified with reduction of the number of grains inside a sample.

Figure optionsDownload as PowerPoint slideHighlights
► Study of mechanical property and microstructure of electrodeposited Cu.
► Non-tapered specimen was used to ensure reliable analysis of mechanical properties.
► The yield strength increased with increase of current density.
► Influence of crystal orientations was magnified with decrease of number of grains.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 111, November 2013, Pages 118–121
نویسندگان
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