Nanoimprinting lithography on 200 mm wafers for optical applications

This paper presents how nanoimprint lithography is developed on 200 mm wafers for the fabrication of two optical devices: parts for optical encoders and organic light emitting diodes with enhanced light extraction efficiency. The optimization of the printing process is shown for both applications. Special studies are presented on the development of etching processes. The removing of the residual layer still needs efforts to guarantee the fidelity of the final patterns but we demonstrated that specific plasma chemistry leads to a high control of the pattern size during this etching step. It is even proved that an over-etch can be performed with no change of the structure dimensions. Final structures duplicated in Si or SiO2 are then presented.