Charge trapping phenomena in high-efficiency metal-oxide-silicon light-emitting diodes with ion-implanted oxide

Analysis of the charge trapping and the variation of the EL intensity during electron injection shows that the current density range can be divided in three portions: (i) low injection level, where electron/hole capture at traps with large capture cross-sections and low ELI occurs; (ii) medium injection level corresponding to the main operation mode of the devices (odd hole trapping depending on the injected current level is observed); and (iii) high injection level (electrical quenching of the EL that correlates with electron capture at traps of extremely small capture cross-sections takes place). The nature of specific hole trapping at the medium injection level in RE-doped devices is discussed. Mechanisms of EL quenching at the high injection level are proposed.