Reliability and gate conduction variability of HfO2-based MOS devices: A combined nanoscale and device level study

The electrical properties and reliability of MOS devices based on high-k dielectrics can be affected when the gate stack is subjected to an annealing process, which can lead to the polycrystallization of the high-k layer. In this work, a Conductive Atomic Force Microscope (C-AFM) has been used to study the nanoscale electrical conduction and reliability of amorphous and polycrystalline HfO2 based gate stacks. The link between the nanoscale properties and the reliability and gate conduction variability of fully processed MOS devices has also been investigated.

The electrical properties and reliability of MOS devices based on high-k dielectrics can be affected when the gate stack is subjected to an annealing process, which can lead to the polycrystallization of the high-k layer. In this work, a Conductive Atomic Force Microscope (C-AFM) has been used to study the nanoscale electrical conduction and reliability of amorphous and polycrystalline HfO2 based gate stacks. The link between the nanoscale properties and the reliability and gate conduction variability of fully processed MOS devices has also been investigated.Figure optionsDownload as PowerPoint slidehighlights
► Nanoscale electrical properties and reliability of MOS devices is investigated.
► A CAFM is used to study electrical conduction of HfO2 based gate stacks.
► Amorphous and polycrystalline gates stacks have been compared.
► A link between nanoscale properties and variability of MOS devices is studied.